AMD’s Brings 29% Speed Boost End PCs

AMD’s Ryzen 7000 Brings a 29% Speed Boost to High-End PCs.

AMD’s Brings 29% Speed Boost End PCs very soon. AMD unveiled its Ryzen 7000 series of desktop PC CPUs on Monday, offering a 29% speed increase over the Ryzen 5000 series. Gamers, video editors, and anyone else who wants top performance will be pleased with the new models, which go on sale on September 27.

There is only one significant task included in the 29% speedup. According to Chief Technology Officer Mark Papermaster in an exclusive interview, the performance increase is 49% when assessing performance for tasks that can utilize all 16 working cores of the processor. According to him, the Ryzen 7000 line equals the performance of a Ryzen 5000 from the previous generation while using 62% less power.

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The most costly model, the Ryzen 9 7950X, costs $699, which is $100 less than the Ryzen 9 5950X did at its introduction in 2020, when the pandemic was just beginning. AMD also sells variants with lower clock rates and fewer of the new Zen 4 processing cores, priced at $549 for the 7900X, $399 for the 7700X, and $299 for the 7600X, respectively. Additionally, AMD will keep promoting its two-year-old 5000 products on computers with reduced prices. It’s fantastic news for anyone looking to purchase a high-end machine. With its new models, AMD will continue to put pressure on Intel, which has been losing sales to it.

According to Papermaster, Taiwan Semiconductor Manufacturing Co., which produces the AMD designs on a more recent 5nm line that generates chips 800 MHz faster and more electrically efficient, deserves some of the credit for the performance gain. 

New packaging methods for chips

However, AMD has more extensively profited from the “chiplet” strategy it pioneered with the first-generation Zen architecture in 2017, which combined several smaller processing units into one larger CPU.

Apple’s M1 Ultra, which joins two M1 Max chips into a single bigger processor, and Intel’s 2023 Meteor Lake processor, which has four distinct processing tiles, three made by TSMC, are examples of how such packaging technology is advancing to the forefront of processor innovation.

Two chiplets with eight Zen 4 cores each make up the Ryzen 9 5950X, together with a chiplet for input-output functions like interacting with memory. Later this year, AMD will include more of these eight-core chiplets in the server CPUs it offers to data center clients. According to Papermaster, you can increase the number of cores from eight to sixteen on a desktop.

 Zen 4-based processors with mobile variants are anticipated in laptops in 2023.

A third dimension in chiplet packaging For its standard chips, AMD mainly uses a conventional side-by-side packaging strategy. But by piling high-speed cache memory on top of the working cores, it has added a more complex third dimension to its packaging options.  Papermaster will not provide an estimated delivery date for the 3D V-Cache models for the Zen 4 generation.

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Packaging flexibility has been crucial to AMD. Because employing the most recent technology increases the cost of the transistor, the fundamental component of a chip’s circuitry, AMD can now make more informed financial decisions. Every generation will see an increase in the price per transistor, according to Papermaster. Chiplets have become crucial because of this.

At AMD’s Ryzen 7000 announcement event on Monday, CEO Lisa Su announced that the company will also utilise chiplets produced using TSMC’s 5nm technology for its future RDNA3 graphics, which serve as the basis for its Radeon graphics processors. She displayed a prototype and claimed that RDNA3 offers 50% greater power efficiency, which is crucial for gamers who want to run software without their PCs getting too hot.

 Don’t write Intel off.

AMD has been successful in part thanks to its chiplet strategy, but it has also benefited from Intel’s significant struggles over the past ten years to advance its manufacturing. That benefit could not continue for very long.

According to Chief Executive Pat Gelsinger, Intel anticipates that its own manufacturing techniques will catch up to competitors by 2024 and beat them by 2025. Additionally, it has been developing its own packaging technology for years. While AMD’s 3D V-Cache is an expensive oddity, Intel will stack chip components using a method known as Foveros in its widely available 2023 Meteor Lake PC processor.

When it comes to chiplet packaging, “Intel offers more varied and technically advanced solutions,” according to Tirias Research analyst Keven Krewell.  Alder Lake, Intel’s most recent CPU, contains that.

Can Intel produce AMD chips?

AMD used to manufacture its own processors, but it later separated that operation to form GlobalFoundries. Papermaster declined to directly address the requirements for joining Intel Foundry Services but stated that it necessitates reliable foundry partners with demonstrated competence and a solid working relationship.

Source: cnet